Electronics Thermal Management Ltd.

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Why Electronics
Cooling?

Consulting

Consulting

Overview

etm's objective is to provide Clients with high level technical expertise to meet their thermal management needs in a cost-effective and timely manner.

We offer consulting and thermal design services at any step of the thermal design process, from identification of the thermal problem, advising on cooling strategy, assessing existing thermal design, to providing verified thermal solutions.

Verified solutions are achieved through combined analytical, semi-empirical and numerical analyses, and experimental characterisation performed either on-site or in a state-of-the-art thermofluids laboratory.

Client projects can be focused at all or specific hierarchical levels of the heat transfer chain in an electronic system, from package- and board level analyses, heat sink design to comprehensive system level analysis.

Consultancy is provided either on-site or in-house.

Expertise and Capabilities

Thermal design services

We can assist in the thermal design from concept to verification on physical prototype. Analyses include:

System level

Cooling strategy: passive and active air-cooling, liquid cooling
Optimisation of cooling design: cabinet unit layout, integration of cooling solution, fan- and vent selection and placement
Design optimisation for cost and manufacturability

Unit- and board level

Component placement
PCB substrate selection
Heat spreading: modifications to PCB mechanics, integration of heat pipe technology and high thermal conductivity materials
Heat sink design for either localised component or board cooling
Minimisation of interface contact resistance: thermal pads, phase change materials

Component level

Package selection
Enhancement of package thermal performance: material selection, heat spreader, slug or lid design, interface material selection
Boundary conditions for thermo-mechanical and electrical performance analyses

Optimisation of Client thermal design process

Thermal roadmaps: cooling strategy and technology
Guidance on the application of; analytical, semi-empirical, and numerical analyses to electronics thermal design, and experimental methods for characterising electronic equipment thermal performance
Thermal characterisation facility and laboratory development. Sourcing of temperature-, heat flux- and flow measurement instrumentation. Customised design of characterisation equipment, such as wind tunnels, fan flow characterisation units and characterisation enclosures
Implementation of the SEMI and JEDEC standards on component thermal characterisation

To discuss your specific consulting needs, please contact us.

Assessment of axial fan
performance as a function of
environmental condition.

Heat sink design - optimisation of
natural convection and radiative
heat transfer.

Infrared imaging of the surface
temperature distribution on a
heat sink - frontal view.

Numerical prediction of
thermal interaction between
electronic components.

Airflow visualisation over a
multi-component board.