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| Publications Refereed journal publications Rodgers, P., Eveloy, V., and Davies, M., 2003, "An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection: Part I – Experimental Methods and Numerical Modelling," Transactions of the ASME, Journal of Electronic Packaging, Vol. 125, No. 1, pp. 67-75. Rodgers, P., Eveloy, V., and Davies, M., 2003, "An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection: Part II – Results and Discussion," Transactions of the ASME, Journal of Electronic Packaging, Vol. 125, No. 1, pp. 76-83. Eveloy, V., Rodgers, P., and Hashmi, M.S.J., 2002, “Application of Experimental Airflow Visualization Techniques to Aid the Numerical Modeling of Electronic Component Convective Heat Transfer,” The International Journal of Microcircuits and Electronic Packaging, Vol. 25, No. 3, pp. 1-31. Eveloy, V., and Rodgers, P., 2002, “Board-Mounted Electronic Component Transient Thermal Behavior: CFD Prediction versus Measurement”, The International Journal of Microcircuits and Electronic Packaging, Vol. 25, No. 1, pp. 27-50. Eveloy, V., Lohan, J., and Rodgers, P., 2000, “A Benchmark Study of Computational Fluid Dynamics Predictive Accuracy for Component-Printed Circuit Board Heat Transfer,” IEEE Transactions on Components and Packaging Technology (CPT), Vol. 23, No. 3, pp. 568-577. Lohan, J., Tiilikka, P., Rodgers, P., Fager, C.M., and Rantala, J., 2000, “Experimental and Numerical Investigation into the Influence of Printed Circuit Board Construction on Component Operating Temperature in Natural Convection,” IEEE Transactions on Components and Packaging Technology (CPT), Vol. 23, No. 3, pp 578-586. Lohan, J., Rodgers, P., Fager, C.M., Lehtiniemi, R., Eveloy, V., Tiilikka, P., and Rantala, J., 1999, "Validation and Application of Different Experimental Techniques to Measure Electronic Component Operating Junction Temperature," IEEE Transactions on Components, Packaging and Manufacturing Technology (CPMT) – Part A, Vol. 22, No. 2, pp. 252-258. Conference publications Eveloy, V., Rodgers, P., and Hashmi, M.S.J., 2003, “An Experimental Assessment of Computational Fluid Dynamics Predictive Accuracy for Electronic Component Operational Temperature,” Proceedings of the ASME Summer Heat Transfer Conference, Las Vegas, Nevada, USA, July 21-23, Paper Number HT2003-47282. Rodgers, P., 2003, “Prediction of Microelectronics Thermal Behavior in Electronic Equipment: Status, Challenges and Future Requirements,” Proceedings of to Fourth Thermal & Mechanical Simulation and Experiments in Micro-electronics and Microsystems Conference (EuroSimE), Aix-en-Provence, France, March 30 – April 2, pp. 29-39. Eveloy, V., Rodgers, P., DeVoe, J., Ortega, A., and Hashmi, M.S.J., 2003, “An Experimental Assessment of Compact Thermal Models for Board-Mounted Electronic Component Heat Transfer,” Proceedings of the Nineteenth IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM XIX), San Jose, CA, USA, March 11-13, pp. 300-312. Eveloy, V., Rodgers, P., and Hashmi, M.S.J., 2003, “Numerical Prediction of Electronic Component Heat Transfer: An Industry Perspective,” Proceedings of the Nineteenth IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM XIX), San Jose, CA, USA, March 11-13, pp. 14-26. Eveloy, V., Rodgers, P., and Lohan, J., 2002, “Numerical Heat Transfer Predictive Accuracy for an In-Line Array of Board-Mounted PQFP Components in Free Convection, “ Proceedings of the Third International Conference on Thermal and Mechanical Simulation in (Micro)Electronics (EuroSimE), Paris, France, April 14-16, pp. 101-109. Eveloy, V., Rodgers, P., and Lohan, J., 2002, “Comparison of Numerical Predictions and Experimental Measurements for the Transient Thermal Behavior of a Board-Mounted Electronic Component,” Proceedings of the Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM 2002), San Diego, CA, May 29-June 1, pp. 36-45. Lohan, J., Eveloy, V., and Rodgers, P., 2002, “Visualization of Forced Air Flows over a Populated Printed Circuit Board and their Impact on Convective Heat Transfer,” Proceedings of the Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM 2002), San Diego, CA, May 29-June 1, pp. 501-511. Eveloy, V., Rodgers, P., and Lohan, J., 2001, “Numerical Heat Transfer Predictive Accuracy for an In-Line Array of Board-Mounted PQFP Components in Forced Convection,” Proceedings of The PACIFIC Rim/ASME International Electronic Packaging Technical Conference & Exhibition (IPACK’01), Paper No. IPACK2001-15690. Eveloy, V., Rodgers, P., and Lohan, J., 2001, “On Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection,” Proceedings of the Seventh International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), pp. 36-42. Lohan, J., Tiilikka, P., Rodgers, P., Fager, C.M., and Rantala, J., 2000, “Using Experimental Analysis to Evaluate the Influence of Printed Circuit Board Construction on the Thermal Performance of Four Package Types in both Natural and Forced Convection,” Proceedings of the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM‘2000), pp. 213-225. Rodgers, P., Eveloy, V., Lohan, J., Fager, C.M., Tilikka, P., and Rantala, J., 1999, "Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-component Printed Circuit Boards in Natural Convection Environments," Proceedings of the Fifteenth IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM XV), pp. 55-64. Rodgers, P., Lohan, J., Eveloy, V., Fager, C.M., and Rantala, J., 1999, "Validating Numerical Predictions of Component Thermal Interaction on Electronic Printed Circuit Boards in Forced Convection Air Flows by Experimental Analysis," Advances in Electronic Packaging; Proceedings of The PACIFIC RIM/ASME International Intersociety Electronic & Photonic Packaging Conference (InterPACK’99), EEP-Vol. 26-1, pp. 999-1009. Rodgers, P., Eveloy, V., Lohan, J., Fager, C.M., and Rantala, J., 1999, "Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-component Printed Circuit Boards in a Forced Convection Environment: Part I – Experimental and Numerical Modelling," Proceedings of the 33rd ASME National Heat Transfer Conference, NHTD99-167. Rodgers, P., Eveloy, V., Lohan, J., Fager, C.M. and Rantala, J., 1999, "Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-component Printed Circuit Boards in a Forced Convection Environment: Part II – Results and Discussion," Proceedings of the 33rd ASME National Heat Transfer Conference, NHTD99-325. Rodgers, P., Lohan, J., Eveloy, V., and Fager, C.M., 1999, "Impact of Convective Environment on the Distribution of Heat Transfer from Three Electronic Component Package Types – Operating on Single- and Multi-Component Printed Circuit Boards," Proceedings of the Fifth International Workshop on Thermal Investigations of ICs and Microstructures (THERMINIC), pp. 214-220. Lohan, J., Tilikka, P., Rodgers, P., Fager, C.M., and Rantala, J., 1999, “Effect of PCB Thermal Conductivity on the Operating Temperature of an SO-8 Package in a Natural Convection Environment: Experimental Measurement versus Numerical Prediction," Proceedings of the Fifth International Workshop on Thermal Investigations of ICs and Microstructures (THERMINIC), pp. 207-213. Lohan, J., Rodgers, P., Fager, C.M., Lehtiniemi, R., Eveloy, V., Tilikka, P., and Rantala, J., 1998, "Experimental Validation of Experimental Techniques to Measure Electronic Component Operating Junction Temperature," Proceedings of the Fourth International Workshop on Thermal Investigations of ICs and Microstructures (THERMINIC), pp. 233-238. Leppävuori, S., Eveloy, V., Kukkola, K., Lahti, M., and Uusimäki, A., 1995, “Use of Gravure Offset Printing in Realisation of a Resistive Temperature Sensor,” Proceedings of the Tenth European Micro-electronics Conference, pp. 387-393. Rodgers, P., and Davies, M., 1994, “Air Velocity and Temperature Measurements Around Three Rectangular Naturally Convecting Fin Arrays,” Proceedings of the Fourth Intersociety Conference on Thermal Phenomena in Electronic Systems (ITHERM’94), pp. 190-197. Rodgers, P., and Davies, M., 1994, “Air Velocity and Temperature Measurements Around a Naturally Convecting Fin Array,” Thermal Management of Electronic Systems: Proceedings of EUROTHERM Seminar 29, Editors, Hoogendoorn, C. J., Henkes, R. A. W. M., and Lasance, C. J. M., Kluwer Academic Publishers, pp. 211-220. Rodgers, P., Davies, M., Lohan, J. and Punch, J., 1992, “Thermal Design Aspects for the Manufacture of Electronic Equipment,” Proceedings of the Ninth Conference of the Irish Manufacturing Committee, pp. 825-834. Lohan, J., Davies, M., and Rodgers, P., 1992, “Transient Thermal Behaviour of Solid State Devices Induced by Manufacturing Processes,” Proceedings of the Ninth Conference of the Irish Manufacturing Committee, pp. 835-844. Davies, M.R.D., Punch, J., Rodgers, P., 1991, "Three Dimensional Conductive Heat Transfer from Discrete Periodic Sources to a Convective Sink," Proceedings of the Sixth Annual Conference of the European Consortium for Mathematics in Industry, B.G. Teuber, Stuttgart. Technical articles Rodgers, P., and Eveloy, V., 2001, “An Experimental Assessment of Numerical Predictive Accuracy for Board-Mounted Electronics Heat Transfer,” CoolingZone, Vol. 2, No. 5. Rodgers, P., 2001, “ Wind Tunnels for Thermal Characterization,” Electronics Cooling, Vol. 7, No. 2. Azar, K., and Rodgers, P., 2001, “Visualization of Air Flows in Electronic Systems,” Electronics Cooling, Vol. 7, No. 2. Punch, J., Davies, M., and Rodgers, P., 1992, “Thermal Management of Power Converters,” published by Power Electronics Ireland, University of Limerick, Limerick, Ireland, in co-operation with Computer Products, Youghal, Co. Cork, Ireland. Davies, M., Rodgers, P., and Punch, J., 1991, ”Cooling Electronic Power Supplies,” Technology Ireland, Vol. 23, No 6, pp. 24-26. |
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