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Training

In today’s product development environment, an efficient thermal design strategy requires knowledge of both experimental and numerical methods, with an awareness of the latest developments in thermal cooling technologies.  Such expertise is a pre-requisite to permit high-quality, cost-effective thermal design solutions to be implemented in the shortest possible turnaround time.
 
etm offers professional development courses in all facets of electronics cooling to address the thermal management needs of engineers, managers and scientists involved in the thermal management, thermo-mechanical issues or reliability of electronic systems. 

Course topics include:
 
Analysis and design methods:
  • Link between temperature and reliability
  • Thermofluids fundamentals
  • Application of analytical, semi-empirical and numerical techniques
  • Cooling strategies - from conventional to advanced
Experimental characterisation:
  • Principles and application of experimental techniques to measure temperature, heat transfer rates and fluid flow in electronic systems
All short courses contain practical application examples for the thermal design and characterisation of electronic equipment, from component to system level, and draw upon in-house applied research published internationally. 
 
Courses can be customised to Client’s needs, and presented at varying levels from introductory to advanced over one- to three-day periods.
 
Courses can be offered at Client premises, regional organised venues and international conferences. Please contact us for further information.


Forthcoming conference
presentation
 
“Heat Sink Design and Analysis for Microelectronic Equipment”
Invited half-day short course,
to be presented at the Fifth
International Conference on
Thermal, Mechanical and
Thermo-mechanical Simulation
and Experiments in Micro-electronics
and Micro-systems (EuroSimE),
Brussels, Belgium, May 9, 2004.
Course outline

Previous conference
presentations

“Application of CFD Analysis to the Thermal Design of Electronic Equipment – Modeling Methodologies, Capabilities and Limitations”
Invited one-day short course presented at the Nineteenth IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM XIX), San Jose, CA, USA.
March 9, 2003.
Course outline

“Experimental Characterisation of Electronic Components and System Thermal Performance”
Invited one-day short course presented at the Fourth Thermal & Mechanical Simulation and Experiments in Micro-electronics and Microsystems Conference (EuroSimE), Aix-en-Provence, France, March 30, 2003.
Course outline

“Practical Application of CFD Analysis to the Prediction of Board-Mounted Electronics Heat Transfer”
Invited one-day short course, presented at the Third International Conference on Thermal and Mechanical Simulation in (Micro)Electronics (EuroSimE), Paris, France, April 14-17, 2002.
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